The phenomenon is more common. H vacuum pumps are specially designed to handle harsh thin film process environments. The successful performance of H series dry pumps in the LPCVD silicon nitride process was described.
Due to process chemicals and their properties, thin film deposition can easily generate solid dust and compressible vapors. The by-products of these processes have a huge effect on the vacuum pump, especially in the vacuum pump deposition or accumulation. In severe cases, it will cause the shutdown of the chip production. Therefore, an effective solution to minimize downtime and maximize stable operation is very important.
1iH series harsh semiconductor process design. Based on extensive field tests to confirm the operation of iH vacuum pumps, LPCVDnitride is one of the harshest processes. After 13 months of evaluation at an important chip processing plant, the following three key conclusions were reached: No deposition in the vacuum pump; in) unless high temperature or low partial pressure is maintained. The effluent gas stream also contains some silicon nitride particles, unreacted DCS, ammonia gas, and may be tested at unspecified conditions in a high-yield DRAM processing plant for iH100. The vacuum pumps previously used in this factory are often stuck because chlorinated ammonia is deposited in the pump body as dust, causing the gap between the rotor and the stator to decrease. During the experiment, in addition to occasional inspections by BOCE Edwards of the air intake and exhaust ports of the vacuum pump and testing of the restart performance, the entire system was uninterrupted without any interruption. In 4O5 days of operation, about 2OOO furnaces and 3OOOOO chips were produced. Approximately 16 kg of ammonium chloride was produced and passed through the vacuum pump in a gaseous manner. There was no sudden pump failure during this period and there was no chip loss due to the pump. This iHlOOO did a full inspection after the experiment was over.
There are almost no deposits in the dry and booster pumps. This explains the excellent restart performance of the vacuum pump throughout the experiment. See picture booster box filming technology!
The inlet layer 3 of the pump concludes that the iH10OO test in a high-throughput DRAM processing plant, 405 days in the LPCVDnitride process. Experiments show that: low maintenance requirements; no accumulation of deposits in the pump body (although there is approximately 16 kg by-product of pumping the ammonia layer through the vacuum pump). This also shows that solid deposits are less likely to cause the final failure of the vacuum pump, achieving a 1009 vacuum run time during the production of 30,000 chips (no pump-induced chip loss and downtime).
International News* FSI International Receives Multiple ZETA "System Orders From Leading Chip Manufacturers Worldwide:" 1 International Company Announces That In The Second Quarter Of This Year, The Company Obtained More From The Leading Semiconductor Manufacturers = 00 >> And orders for the 800mmZET* spray cleaning system come from new and existing customers in the United States, Europe, Asia Pacific, and Japan, some of whom are the world's leading chip makers and one of the world's largest chip packaging plants. , ETA system orders to: 1 The number of surface treatment product orders in the second quarter increased by 609 from the previous quarter. The ZETA system is very versatile and shows its ability to meet or exceed user requirements from beginning to end.
The ZETA system can be used either at the front end of the production line or at the back end of the production line. Can complete the delamination of the photoresist, ash cleaning and general cleaning. In the backend packaging phase, the ZETA system will be used for various photoetching and cleaning operations.
=00>>,! 300>> Fully automatic configuration and targeting of wafers!
150>>,! =00>> Semi-automatic configuration of wafers. The TA system has a wide range of applications including stripping and ember cleaning of 0L photoresist, BE0L ember cleaning, salicylic acid removal, round ball pins on wafers, and wafer recycling. The system uses centrifugal spray technology.
FSntemational, headquartered in Minnesota, United States, is a processing equipment supplier with more than 30 years of history and has more than 100 customers in =0 countries around the world. :;1 products include immersion, centrifugal spray, vapor etch, and CryoKinetic chip surface cleaning systems. :;I not only have complete products, but also have high flexibility and strong production capacity, which can help customers solve the problems raised in the advanced manufacturing process, allowing customers to achieve high returns. :;1 products can be used for the production of 100 ~ 300mm wafers.
In order to give customers a better understanding of the products and technologies of:1, the company has hosted two seminars in March of this year, namely “ensure high yield of chip manufacturing†and “for 65nm and higher processes. Cutting-edge cleaning technology." :;1 International is a global supplier of integrated circuit surface cleaning equipment technology and support services, capable of providing a complete range of cleaning equipment.
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